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Room: MC603, 6th floor, Bldg: McConnell Engineering building, 3480 rue University, Montreal, Quebec, Canada, H3A 0C3, Virtual: https://events.vtools.ieee.org/m/472834

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An End-to-End Approach to the Challenges in Photonic Integrated Circuits (PIC) and Packaging

Room: MC603, 6th floor, Bldg: McConnell Engineering building, 3480 rue University, Montreal, Quebec, Canada, H3A 0C3, Virtual: https://events.vtools.ieee.org/m/472834

Abstract : AIM Photonics, a Department of Defense (DoD) Manufacturing Innovation Institute (MII), offers end-to-end services in photonic integrated circuits (PICs), interposers, heterogeneous integration (HI), electronic photonic design automation (EPDA), and packaging. AIM Photonics leverages the 300 mm Albany NanoTech Complex and the Test Assembly and Packaging (TAP) facility in Rochester, NY, to provide these... Read more →