Technical Seminat by Dr. Kemal Aygün (Intel Fellow, IEEE Fellow) with the following abstract: Recently, applications such as artificial intelligence has been evolving very rapidly and bringing with it a more stringent set of requirements for system performance. One area where the performance demand has been scaling very aggressively is that for interconnecting different components in an electronic system using high speed signaling. To address this demand, the pace of innovation in electronic packaging has also increased greatly in recent years, bringing with it a new set of challenges for electrical design, analysis, and validation. This presentation will review some of the recent developments in electronic packaging technologies and corresponding electrical analysis and validation methodologies and metrologies to address some of these challenges. It will also summarize some of the recent advancements on standardization of on-package high speed signaling interconnects with a focus on Universal Chiplet Interconnect Express (UCIe). Speaker(s): Kemal Aygün Virtual: https://events.vtools.ieee.org/m/372342