2 events found.
An End-to-End Approach to the Challenges in Photonic Integrated Circuits (PIC) and Packaging
Room: MC603, 6th floor, Bldg: McConnell Engineering building, 3480 rue University, Montreal, Quebec, Canada, H3A 0C3, Virtual: https://events.vtools.ieee.org/m/472834Abstract : AIM Photonics, a Department of Defense (DoD) Manufacturing Innovation Institute (MII), offers end-to-end services in photonic integrated circuits (PICs), interposers, heterogeneous integration (HI), electronic photonic design automation (EPDA),... Read more
Pioneering the Future of Connectivity: The IEEE 5G/6G Innovation Testbed Ecosystem
Room: 146, 12280 NE District Wy, Bellevue, Washington, United States, 98005In an age when 5G is already reshaping industries and everyday life, continuous innovation is essential to unlock its full potential. The IEEE testbed provides a dynamic environment where academia,... Read more